|
型 号
|
厂 家
|
封 装
|
批 号
|
|
CB714-80007
|
STM/HP
|
BGA
|
21+
|
|
IF238
|
INNOFIDEI
|
BGA
|
21+
|
|
MM1491SNRE
|
MITSUMI
|
SOT363
|
21+
|
|
KPEG611SAN
|
KINGSTATE
|
DIP
|
21+
|
|
RT8966AZQW
|
RICHTEK/立锜
|
QFN32
|
21+
|
|
CW1053ATAP
|
CELLWISE/赛微
|
SOP16
|
21+
|
|
TJA1042TK/3.118
|
NXP/恩智浦
|
SON8
|
21+
|
|
SDIN4C2-2G
|
SANDISK
|
BGA
|
21+
|
|
PIC24FJ64GA002-E/SS
|
MICROCHIP/微芯
|
SSOP28
|
21+
|
|
PIC24FJ32GA002-E/SS
|
MICROCHIP/微芯
|
SSOP28
|
21+
|
|
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