|
型 号
|
厂 家
|
封 装
|
批 号
|
|
CL10B272KB8NNNC
|
SAMSUNG/三星
|
0603-
|
21+
|
|
NT3H1201W0FHK
|
NXP/恩智浦
|
XQFN8
|
21+
|
|
DEA211898BT-9033B1
|
TDK/东电化
|
SMD
|
21+
|
|
2SJ2284-103592F
|
SINGATRON
|
SMD
|
21+
|
|
HF115F-S
|
HF
|
DIP6
|
21+
|
|
IP108
|
ICPLUS
|
QFP128
|
21+
|
|
RR274EA-400
|
ROHM/罗姆
|
SOT-153
|
21+
|
|
GS1G_R1_00001
|
PANJIT
|
SMA
|
21+
|
|
2R600A5L
|
UNICTRON
|
DIP
|
21+
|
|
R5F562T7DDFK#V1
|
RENESAS/瑞萨
|
LQFP64
|
21+
|
|
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